HTS has developed a proven process for reballing Ball Grid Array (BGA) components to restore them to the original specification for reuse.

Our reballing processes can be used to restore a wide assortment of BGA packages (including micro-BGAs) such as plastic, ceramic and wafer-level BGAs.

HTS BGA reballing methodologies and technologies is committed to provide exceptional quality with the goal of transforming your devices into the reliable products you want.